Options

  • Bowl clean
  • Exhaust controller
  • Optical EBR
  • Flood expose
  • Fire suppression
  • Temperature control
  • Additional backside rinses
  • Spare bowl – quick change
  • Syringe dispense
  • Pump dispense
  • Multiple wafer sizes without hardware change
  • Square substrates
  • Environmental control unit (ECU)
  • Optical centering
  • Resist bottle caps
  • Closed lid co-rotating SynchroSpin

Coater

  • Open hot plate (Standard)
  • Closed lid with nitrogen purge
  • Vacuum bake
  • Temperature control
  • Multiple developers
  • Solvent/Aspirated develop
  • Spray – Stream – Low Impact
  • Optical EBR
  • Optical centering
  • Flood expose

 

  • Nitrogen blow off
  • Porous chuck
  • Frame edge clean
  • Custom cassettes
  • Hot plate ovens
  • Heated DI water
  • Chemical mixing systems
  • Aspirated heated DI water for cleaning
  • DI water doping for ESD control
  • Fire suppression
  • Diverting valve (solvent and water separation)

Wafer cleaner, wafer scrubber:

  • High pressure clean
  • Heated fluids
  • DI water doping for ESD control
  • Wafer scrub brushes – multiple options
  • Multiple chemical dispenses

 

Lift Off:

  • Heated solvent
  • Fire suppression
  • Diverting valve (solvent and water separation)

 

 

Wafer Inspection System V2000:

  • OCR (top and bottom)
  • Multiple lights (Spot, dark field, multiple spectrum neon, monochromatic green, other custom lights)
  • Backside inspection
  • Digital image capture
  • Notch/flat find
  • Multiple wafer sizes without hardware change
  • SECS/GEM

 

Wafer Inspection System V3000:

  • OCR (top and bottom)
  • Multiple lights (Spot, dark field, multiple spectrum neon, monochromatic green, other custom lights)
  • Backside inspection
  • Digital image capture
  • Notch/flat find
  • Multiple wafer sizes without hardware change
  • SECS/GEM

 

Wafer Microscope Loader:

  • OCR (top and bottom)
  • Multiple wafer sizes without hardware change
  • Macro inspection light
  • SECS/GEM

 

Wafer Sorter:

  • OCR (top and bottom)
  • Multiple wafer sizes without hardware change
  • Macro inspection light
  • SECS/GEM
  • Light curtain
  • Multiple cassettes
  • Optical centering
  • Ionizer
  • Uninterruptible Power Supply (UPS)
  • Barcode reader
  • Open hot plate (Standard)
  • Closed lid with nitrogen purge
  • Vacuum bake