P8060 Copper Bump Developer

copper_bumber-dry_film_developer

The C&D P8000/P9000 Copper Bump Developer

The Copper Bump Developer was designed specifically for developing dry laminated film resist. The high capacity heat exchanger allows process solution temperature to remain constant ± 2.0˚C and achieving up to 40˚C for long constant spray develop cycles often required by thick laminated films. The heat exchanger can control the developer temperature to four process modules simultaneously for maximum flexibility and throughput. C&D’s pressure tanks can interface with a bulk delivery system that dilutes the developer from a concentrate. This dilution system mixes and fills the canisters without track interruption saving time and money.