Metal Lift-Off System
C&D offers both the P9000 and P8000 Lift-off Systems, which are fully automated and designed for metal lift-off application. The cassette to cassette design offers a reduced overall system footprint. C&D uses a low pressure spray to soak the wafer for a programmed duration – this is followed by a high pressure fine needle spray. The programmed arm sweeps across the wafer to evenly lift off unwanted metal.