P8010 Advanced Linear Track System

P8000-10 Advanced Linear Track System

P8000 Advanced Linear Track System

The P8000 Advanced Linear Track System is a recipe-driven photoresist coater and developer, featuring powerful Rabbit Microprocessors and an intuitive graphical user interface (GUI), which provides unprecedented capabilities for linear track systems. The system offers a wide range of functions which include expanded recipe storage, data logging, manual exercise mode, and system networking. A vast improvement over the SVG 8X systems, the P8000 Linear Track ditches the nearly obsolete card cage control system for a C&D developed controller using a fully PC controlled system. The P8000 photoresist coater can be configured with several different modules for coating, developing, baking, priming, and chilling. Additional process specializations can also be added, including the use of UV flood exposure units.

For more versatility and advanced functionality, see the P9000 Cluster System

P8000 Options

Coater Options

  • C&D Exhaust controller for precise process control
  • Fire suppression packages available
  • Temperature control photoresist and dispense
  • Additional backside rinses
  • Multiple Syringe dispenses capable
  • Multiple Pump dispenses capable
  • Multiple wafer sizes without hardware change
  • Round & Square substrates
  • Environmental control unit (ECU)
  • Custom Resist bottle caps

Developer Options

  • Temperature controlled Chemistry dispenses 
  • Multiple developers for separate chemistry
  • Solvent/Aspirated develop
  • Multiple nozzle options (Spray – Stream )

Hot Plates Options

  • Open hot plate (Standard)
  • Vacuum bake
  • Multiple wafer sizes without hardware change

Chill  Plate Options

  • Anodized Aluminum contact plate
  • Circulated Water
  • High-Efficiency Option
  • House water supply or Electronic Heating/Cooling Circulator

  • Multiple wafer sizes without hardware change

Vapor Prime 

  • Closed lid with chemistry purge
  • Sealed vacuum operation
  • Multiple wafer sizes without hardware change
  • Includes 1 gallon pressure canister for HMDS

Scrubber Features

  • High pressure clean
  • Heated fluids
  • DI water doping for ESD control
  • Wafer scrub brushes – multiple options
  • Multiple chemical dispenses

Learn More

Alloy Module

  • Process temperatures up to 500C
  • Closed lid operation
  • Integrated nitrogen cooling ring
  • Multiple purge gases through chemical manifold
  • Adjustable process height using programmable lift pins
  • Alternative to traditional RTA oven methods